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Air Emissions from Laser Drilling of Printed Wiring Board Materials.


PB99137424

Publication Date 1999
Personal Author Darvin, C. H.; Kershner, C. J.
Page Count 6
Abstract The paper gives results of a study to characterize gases generated during laser drilling of printed wiring board (PWB) material and identifies the pollutants and generation rates found during the drilling process. The electronics packaging industry has traditionally relied on mechanical drilling systems to prepare holes in PWB material. Recently, however, a potentially new and innovative application for laser technology was developed for drilling PWB holes. This application of lasers has the potential to significantly reduce the time and cost of producing PWBs. The process is also predicted to reduce the volume of solid waste product generated during PWB manufacture. The continuing question presented on the use of laser drilling is its potential for producing air pollution which may be generated from thermal decomposition at the laser drilling site.
Keywords
  • Laser drilling
  • Printed circuit boards
  • Emissions
  • Electronic packaging
  • Thermal decomposition
  • Pyroysis
  • Carbon monoxide
  • Carbon dioxide
  • Methane
  • Hydrocyanic acid
  • Air pollution sources
  • Solid waste management
Source Agency
  • Environmental Protection Agency Office of Research and Development
Corporate Authors Mound Laser and Photonics Center, Inc., Miamisburg, OH.; Environmental Protection Agency, Research Triangle Park, NC. National
Supplemental Notes Presented at the IPC Printed Circuits Expo '99, Long Beach, CA., March 14-18, 1999. Sponsored by Environmental Protection Agency, Research Triangle Park, NC. National Risk Management Research Lab.
Document Type Conference Proceedings
Title Note Rept. for May 95-Jul 97.
NTIS Issue Number 199913
Air Emissions from Laser Drilling of Printed Wiring Board Materials.
Air Emissions from Laser Drilling of Printed Wiring Board Materials.
PB99137424

  • Laser drilling
  • Printed circuit boards
  • Emissions
  • Electronic packaging
  • Thermal decomposition
  • Pyroysis
  • Carbon monoxide
  • Carbon dioxide
  • Methane
  • Hydrocyanic acid
  • Air pollution sources
  • Solid waste management
  • Environmental Protection Agency Office of Research and Development
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